Inorganic adhesive formula

[Formula 1] Copper Oxide-Phosphorate <br> Copper Oxide (325 mesh) 100 Phosphoric Acid 37.7-56.6 Aluminum Hydroxide 2-2.8
This formula is a general-purpose inorganic glue. The amount of phosphoric acid and aluminum hydroxide should be determined according to the ambient temperature. The smaller the amount of addition, the higher the strength and the faster the curing speed, but the shorter the glue's active period is (25°C, the amount of addition is 37.7, and the activity period is only 10 Min or so), can not meet the construction requirements. Usually, in winter, the proportion of phosphoric acid and aluminum hydroxide is small, and in summer, the ratio of adding a large amount is used. Curing conditions are room temperature, 2-3h; 80°C, 2-4h; or room temperature 2-3 days. It is advisable to use 10-15g for one time. The maximum operating temperature is 600°C. Widely used in steel, aluminum, iron, copper, hard alloys, ceramics, bakelite and other materials glued.

[Recipe 2] Copper Oxide-Phosphorate <br> Copper Oxide (325 mesh) 35-60 Phosphoric Acid 17 Aluminum Hydroxide 1 Sodium Tungstenate 1.7-3 Zirconia 0.3-0.6
This formula is an improved inorganic glue, with zirconia to improve the heat resistance of the glue, the maximum use temperature can reach 1000 °C. Adhesive strength has also been significantly improved. Shear strength steel and steel overlap 10-15MPa; socket for 40-100MPa. Tensile strength steel and steel 8-15MPa. Torsional strength steel and steel is 40MPA. Suitable for closed, semi-enclosed turning tools, molds and metal materials such as glued.

[Recipe 3] Silicate Gel <br> Sodium Silicate (35-45%) 75-85 Urea 2-10 Sugar 0.5-3 Sodium Dichromate 0.1-1
Magnesium sulfate 1-4 White clay 0-8 Water 100
This formula is a general-purpose silicate glue, and the proportions of the above components are adjusted according to different requirements. Excellent heat resistance and flame retardancy, but poor water resistance. Suitable for adhesive bonding of metal foils, siding, paper boxes, paper tubes, plywood and packaging materials.

[Formula 4] Silicate Gel <br> Sodium Silicate 100 Asbestos Cement 59 Lead Oxide 5.2 Glycerin 2.6 Rosin 2.6
This formula is a modified silicate glue with good water resistance. Suitable for bonding of various porous materials.

[Recipe 5] Phosphate-silicate glue <br> Aluminum phosphate 100 Aluminum silicate 200 Phosphoric acid 100 Water 150
This formula can withstand high temperatures of 120-1300°C and low temperatures of -70°C, and has good water, moisture, and electrical insulation properties. However, acid and alkali resistance is poor. Suitable for metal sockets. When preparing, aluminum phosphate and aluminum silicate are mixed and burned for 1 hour at a high temperature of 1100-1150°C, then ground and sifted (325 mesh), and mixed with phosphoric acid and water during construction. Curing conditions were room temperature, 2 h; 40-60° C., 3 h; 80-100° C., 2 h; 120-150° C., 2 h; 160-200° C., 2 h; 200-220° C., 1 h.

[Formula 6] Phosphate-silicate glue <br> Aluminum phosphate 50 Aluminum silicate 100 Al2O3 100 Zirconium oxide 45 Phosphoric acid 3 Water 4.5
This formula is an improved phosphate-silicate glue. Can withstand high temperatures of 1400-15000C and -700 C temperatures. With excellent water resistance,
Oil and electrical insulation properties. In the preparation, aluminum phosphate and aluminum silicate are fired at 1100-11500C for 1h and sieved through 325 mesh; aluminum oxide is burned at 1100-13000C for 1-2h and sieved through 325 mesh; Mix evenly. Curing conditions were room temperature, 2h, 40-60°C, 3h, 80-100°C, 3h, 100-150°C, 2h, 160-200°C, 2h, 200-250°C, 2h, 250- 300 °C, 1h.

[Formula 7] Sulfate gel <br> Calcium sulfate 100 Urea formaldehyde resin 77 Ammonium chloride (10% aqueous solution) 3.4
This formula is a resin modified sulfate gel. Curing conditions are room temperature, 15-30 minutes (basic curing), and high strength can be achieved within 3-4 days. The compressive strength is 70 MPa.

[Formula 8] Glue powder <br> Borax 100 Alumina 8 Nickel oxide 20 Iron oxide 20 Potassium nitrate 28
Potassium carbonate 60 Red lead powder 24 Quartz powder 120 Sodium fluoride 20
This formula is suitable for the bonding of ceramic and metal. When preparing, mix the above components first, then dry at low temperature to remove water, and then burn for 1-2 hours at a high temperature of 900°C.
[Formula 9] Inorganic Mastic MgO 100 Fumed silica 50 Quartz powder 150 Borax 500 Magnesium chloride 100
This formula is magnesium oxide clay. Suitable for bonding of bamboo, wood, glass, stone, ceramics and other materials. Curing conditions are room temperature, 10 days (basic curing), up to 30 days maximum strength. The tensile strength is 70-90MPa.

[Formula 10] Inorganic Mastic < Iron Powder 100 Quicklime 75 Borax 175 Cinder Powder 100 Magnesium Chloride 25
This formula is iron mortar. Suitable for glued joints of car radiator lids and iron pipes. Curing conditions are room temperature for 7 days (up to maximum strength). The flexural strength is 7.7 MPa. The compressive strength is 32.5MPa.

[Formula 11] Inorganic Mastic <br> Sulfur 100 Silica Sand 51 Soapstone 17 Carbon Black Province 1.7 Polysulfide Rubber 0.85
This formula is a sulfur cement. Use below 90°C with good water resistance and acid resistance. The maximum use temperature must not exceed 130°C. Has excellent adhesive properties, compressive strength up to 70 MPa. Tensile strength is 6.3MPa. Suitable for bonding ceramics, metals, especially copper alloys. When immersed in water at 70°C for 2 years and immersed in nitric acid, sulfuric acid, hydrochloric acid and hydrofluoric acid at 70°C for 8 months, the bonding strength was not significantly decreased.

[Formula 12] Inorganic Mastic <br> Pyrolusite 100 Zinc Oxide 49 Borax 10
This formula is a manganese cement. When mixing, mix the above components with water glass into a uniform paste. Suitable for bonding of glass, ceramics, metals and other materials.

Source: 21st Century Fine Chemicals Network