According to GB/T 7123.1-2002, the viscosity of the adhesive to determine the pot life, Figure 1 shows the adhesive at room temperature viscosity time curve.
As can be seen from Figure 1, the viscosity of the adhesive at room temperature increases with time, and the coordinate at the inflection point of the curve is obtained by the linear regression method (77, 238). The viscosity of the curve at the inflection point increases rapidly. The time at this point is For the pot life of the adhesive, the adhesive has a pot life of 77 minutes.
2.4 Bonding Shear Strength at Different Temperatures
The adhesive shear strengths tested at different temperatures after the adhesive was cured at 80°C for 4 h are listed in Table 3.
It can be seen from Table 3 that the shear strength of the adhesive at -60°C reaches 30.3 MPa, and the shear strength at 25°C is the highest, and then the shear strength decreases with increasing temperature, and the shear strength at 200°C is 3.02 MPa.
2.5 Media resistance of adhesives
According to the technical standards [2] to evaluate the adhesive medium resistance, according to the standard sample and a little cured adhesive in the medium for 30min after the change in the strength and quality changes to determine the intensity of the rate of reduction of not more than 20%, the quality of change Less than 1% is good for media resistance. The changes of the shear strength and the cured product quality of the bonding parts are shown in Table 4 and Table 5, respectively, before and after the different conditions are cured and soaked in different media for 30 minutes.
From Table 4, it can be seen that the shear strength of the standard sample after soaking in 5 different media causes changes, but the drop value is within 20%; as can be seen from Table 5, after the adhesive cured by 5 different media The change in mass is within 1%, indicating that the adhesive has good resistance to media.
2.6 Electrical properties of adhesives
The insulation resistance of this adhesive cured product was tested with a 500V resistance oscillometer, which was greater than 500 MΩ, indicating that the adhesive has good electrical insulation properties.
3 Conclusion
Toughening epoxy resin with ATBN can be made into a heat-resistant, room-temperature curing adhesive at 200°C. The adhesive has good adhesive strength, medium resistance, temperature resistance, electrical insulation properties and meets the technical requirements of a project.
Source: Fine Chemical Network
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